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1:3 and 1:4 single-ended, low cost, active rf splitters ada4304-3/ada4304-4 rev. 0 information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2007 analog devices, inc. all rights reserved. features ideal for catv and terrestrial applications 2.4 ghz, ?3 db bandwidth 1 db flatness: 54 mhz to 865 mhz low noise figure: 4.6 db low distortion composite second-order (cso): ?62 dbc composite triple beat (ctb): ?72 dbc nominal 3 db gain per output channel 25 db output-to-output isolation, 50 mhz to 1000 mhz 75 input and outputs small package size: 16-lead, 3 mm 3 mm lfcsp applications set-top boxes residential gateways catv distribution systems splitter modules digital cable ready (dcr) tvs functional block diagrams vin vout3 vout1 gnd vcc 0.01f il 1h 5 v 5 v ada4304-3 vout2 0.01f 0.01f 0.01f 0.1f 0.1f 07082-001 figure 1. vin vout3 vout1 gnd vcc 0.01f il 1h 5 v 5 v vout4 0.01f vout2 0.01f 0.01f 0.01f 0.1f 0.1f 07082-002 ada4304-4 figure 2. general description the ada4304-3/ada4304-4 are 75 active splitters for use in applications where a lossless signal split is required. typical applications include multituner digital set-top boxes, cable splitter modules, multituners/digital cable ready (dcr) televisions, and home gateways where traditional solutions require discrete passive splitter modules with separate fixed gain amplifiers. the ada4304-3/ada4304-4 are fabricated using the analog devices, inc., proprietary silicon germanium (sige), complementary bipolar process, enabling them to achieve very low levels of distortion with a noise figure of 4.6 db. the parts provide low cost alternatives that simplify designs and improve system performance by integrating a signal splitter element and a gain block into a single ic. the ada4304-3/ada4304-4 are available in a 16-lead lfcsp and operate in the extended industrial temperature range of ?40c to +85c.
ada4304-3/ada4304-4 rev. 0 | page 2 of 12 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagrams ............................................................. 1 general description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 thermal resistance ...................................................................... 4 esd caution .................................................................................. 4 pin configurations and function descriptions ........................... 5 typical performance characteristics ..............................................6 test circ u its ........................................................................................9 applications ..................................................................................... 10 circuit description .................................................................... 10 evaluation boards ...................................................................... 10 rf layout considerations ......................................................... 10 power supply ............................................................................... 10 outline dimensions ....................................................................... 12 ordering guide .......................................................................... 12 revision history 11/07revision 0: initial version
ada4304-3/ada4304-4 rev. 0 | page 3 of 12 specifications v cc = 5 v, 75 system, t a = 25c, unless otherwise noted. table 1. ada4304-3 ada4304-4 parameter conditions min typ max min typ max unit dynamic performance see figure 19 for test circuit bandwidth (?3 db) 2400 2400 mhz frequency range 54 865 54 865 mhz gain f = 100 mhz 3.3 2.9 db gain flatness 54 mhz to 865 mhz 1.0 1.0 db noise/distortion performance noise figure 1 @ 54 mhz 4.0 4.0 db @ 550 mhz 4.6 4.6 db @ 865 mhz 4.8 4.8 db output ip3 f 1 = 97.25 mhz, f 2 = 103.25 mhz 26 26 dbm output ip2 f 1 = 97.25 mhz, f 2 = 103.25 mhz 43 43 dbm composite triple beat (ctb) 135 channels, 15 dbmv/channel, f = 865 mhz ?72 ?72 dbc composite second order (cso) 135 channels, 15 dbmv/channel, f = 865 mhz ?62 ?62 dbc cross modulation (cxm) 135 channels, 15 dbmv/channel, 100% modulation @ 15.75 khz, f = 865 mhz ?68 ?68 dbc input characteristics see figure 19 for test circuit input return loss @ 54 mhz ?17 ?13 ?18 ?14 db @ 550 mhz ?22 ?16 ?21 ?15 db @ 865 mhz ?12 ?8 ?12 ?8 db output-to-input isolation any outp ut, 54 mhz to 865 mhz @ 54 mhz ?33 ?30 ?33 ?31 db @ 550 mhz ?33 ?30 ?33 ?31 db @ 865 mhz ?34 ?31 ?35 ?32 db output characteristics see figure 19 and figure 20 for test circuits output return loss any output, 54 mhz to 865 mhz @ 54 mhz ?21 ?17 ?21 ?17 db @ 550 mhz ?16 ?11 ?17 ?12 db @ 865 mhz ?14 ?9 ?14 ?9 db output-to-output isolation any output, 54 mhz to 865 mhz db @ 54 mhz ?26 ?26 db @ 550 mhz ?25 ?25 db @ 865 mhz ?25 ?25 db 1 db compression (p1db) output referred, f = 100 mhz 9.0 8.7 dbm power supply nominal supply voltage 4.75 5.0 5.25 4.75 5.0 5.25 v quiescent supply current 92 105 92 105 ma 1 characterized with 50 noise figure analyzer.
ada4304-3/ada4304-4 rev. 0 | page 4 of 12 absolute maximum ratings table 2. parameter rating supply voltage 5.5 v power dissipation see figure 3 storage temperature range ?65c to +125c operating temperature range ?40c to +85c lead temperature (soldering, 10 sec) 300c junction temperature 150c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. thermal resistance ja is specified for the device (including exposed pad) soldered to a high thermal conductivity 4-layer (2s2p) circuit board, as described in eia/jesd 51-7. table 3. thermal resistance package type ja unit 16-lead lfcsp (exposed pad) 98 c/w maximum power dissipation the maximum safe power dissipation in the ada4304-3/ ada4304-4 package is limited by the associated rise in junction temperature (t j ) on the die. at approximately 150c, which is the glass transition temperature, the plastic changes its properties. even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance. exceeding a junction temperature of 150c for an extended period can result in changes in the silicon devices, potentially causing failure. the power dissipated in the package (p d ) is essentially equal to the quiescent power dissipation, that is, the supply voltage (v s ) times the quiescent current (i s ). in table 1 , the maximum power dissipation of the ada4304-3/ada4304-4 can be calculated as p d (max) = 5.25 v 105 ma = 551 mw airflow increases heat dissipation, effectively reducing ja . in addition, more metal directly in contact with the package leads/exposed pad from metal traces, through-holes, ground, and power planes reduces the ja . figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 16-lead lfcsp (98c/w) on a jedec standard 4-layer board. 0 0 100 ambient temperature (c) maximum power dissipation (w) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 10 20 30 40 50 60 70 80 90 07082-003 figure 3. maximum power dissipation vs. temperature for a 4-layer board esd caution
ada4304-3/ada4304-4 rev. 0 | page 5 of 12 pin configurations and function descriptions nc = no connect 1 vcc 2 vcc 3 gnd 4 vin 11 gnd 12 vout2 10 vout3 9gnd 5 g n d 6 g n d 7 g n d 8 n c 1 5 v c c 1 6 v c c 1 4 i l 1 3 v o u t 1 ada4304-3 top view (not to scale) pin 1 indicator 07082-004 figure 4. ada4304-3 pin configuration 1 vcc 2 vcc 3 gnd 4 vin 11 gnd 12 vout2 10 vout3 9gnd 5 g n d 6 g n d 7 g n d 8 v o u t 4 1 5 v c c 1 6 v c c 1 4 i l 1 3 v o u t 1 ada4304-4 top view (not to scale) pin 1 indicator 0 7082-005 figure 5. ada4304-4 pin configuration table 4. ada4304-3 pin function descriptions pin o. nemonic description 1, 2, 15, 16 vcc supply pin. 3, 5 to 7, 9, 11 gnd ground. 4 vin input. 8 nc no connection. 10 vout3 output 3. 12 vout2 output 2. 13 vout1 output 1. 14 il bias pin. table 5. ada4304-4 pin function descriptions pin o. nemonic description 1, 2, 15, 16 vcc supply pin. 3, 5 to 7, 9, 11 gnd ground. 4 vin input. 8 vout4 output 4. 10 vout3 output 3. 12 vout2 output 2. 13 vout1 output 1. 14 il bias pin.
ada4304-3/ada4304-4 rev. 0 | page 6 of 12 typical performance characteristics v cc = 5 v, 75 system, t a = 25c, unless otherwise noted. 1000 frequency (mhz) cso (dbc) 07082-020 100 50 t a = ?40c ?74 ?72 ?70 ?68 ?66 ?64 ?62 ?60 ?58 ?56 ? 54 t a = +85c t a = +25c figure 6. composite second order (cso) vs. frequency 1000 frequency (mhz) ctb (dbc) 07082-021 100 50 t a = ?40c t a = +85c ?90 ?87 ?84 ?81 ?78 ?75 ?72 ?69 ?66 ?63 ? 60 t a = +25c figure 7. composite triple beat (ctb) vs. frequency 1000 frequency (mhz) cxm (dbc) 07082-022 100 50 ?90 ?87 ?84 ?81 ?78 ?75 ?72 ?69 ?66 ?63 ? 60 t a = +25c t a = ?40c t a = +85c figure 8. cross modulation (cxm) vs. frequency 1000 frequency (mhz) noise figure (db) 07082-023 100 50 0 10 t a = +25c 50 ? system t a = ?40c t a = +85c 2 4 6 8 figure 9. noise figure vs. frequency 60 20 1000 frequency (mhz) output ip2 (dbm) 07082-010 100 55 50 45 40 35 30 25 50 ada4304-3 ada4304-4 figure 10. output ip2 vs. frequency 40 0 1000 frequency (mhz) output ip3 (dbm) 07082-011 100 50 35 30 25 20 15 10 5 ada4304-3 ada4304-4 figure 11. output ip3 vs. frequency
ada4304-3/ada4304-4 rev. 0 | page 7 of 12 frequency (mhz) gain (db) 07082-024 100 1000 40 ?6 ?5 ?4 ?3 ?2 ?1 5 4 t a = +25c t a = ?40c t a = +85c 0 1 2 3 figure 12. ada4304-3 gain vs. frequency frequency (mhz) gain (db) 07082-025 100 1000 40 ?6 ?5 ?4 ?3 ?2 ?1 5 4 t a = +25c t a = ?40c t a = +85c 0 1 2 3 figure 13. ada4304-4 gain vs. frequency ? 25 ?45 frequency (mhz) output-to-input isolation (db) 07082-013 100 1000 50 ?27 ?29 ?31 ?33 ?35 ?37 ?39 ?41 ?43 ada4304-3 ada4304-4 figure 14. output-to-inpu t isolation vs. frequency 0 ?45 frequency (mhz) output-to-output isolation (db) 07082-014 100 1000 50 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ada4304-4 ada4304-3 figure 15. output-to-output isolation vs. frequency 0 ?30 frequency (mhz) input return loss (db) 07082-015 100 1000 50 ?5 ?10 ?15 ?20 ?25 ada4304-3 ada4304-4 figure 16. input return loss vs. frequency 0 ?30 frequency (mhz) output return loss (db) 07082-016 100 1000 50 ?5 ?10 ?15 ?20 ?25 ada4304-3 ada4304-4 figure 17. output return loss vs. frequency
ada4304-3/ada4304-4 rev. 0 | page 8 of 12 temperature (c) quiescent supply current (ma) 07082-026 75 80 85 90 95 100 ?60 ?50 ?40 ?30 ?20 ?10 0 10 20 30 40 50 60 70 80 90 100 figure 18. quiescent supply current vs. temperature
ada4304-3/ada4304-4 rev. 0 | page 9 of 12 test circuits 07082-018 dut rf network analyzer 75? s-parameter test set 4 vin 75 ? voutm notes 1. tested for all combinations of voutm and voutn. voutn figure 19. test circuit for transmission, isolation, and reflection measurements 0 7082-019 dut voutm notes 1. tested for all combinations of voutm and voutn. rf network analyzer 75? s-parameter test set 4 voutn 75 ? vin figure 20. test circuit for output-to-output isolation measurements
ada4304-3/ada4304-4 rev. 0 | page 10 of 12 applications the ada4304-3/ada4304-4 active splitters are primarily intended for use in the downstream path of television set-top boxes (stbs) that contain multiple tuners. they are typically located directly after the diplexer in a bidirectional catv customer premise unit. the ada4304-3/ada4304-4 provide a single-ended input and three or four single-ended outputs that allow the delivery of the rf signal to multiple signal paths. these paths can include, but are not limited to, a main picture tuner, the picture-in-picture (pip) tuner, an out-of-band (oob) tuner, a digital video recorder (dvr), and a cable modem (cm). the ada4304-3/ada4304-4 exhibit composite second-order (cso) and composite triple beat (ctb) products that are ?62 dbc and ?72 dbc, respectively. the use of the sige bipolar process also allows the ada4304-3/ada4304-4 to achieve a noise figure (nf) of 4.6 db at 550 mhz. circuit description the ada4304-3/ada4304-4 consist of a low noise buffer amplifier followed by a resistive power divider. this arrangement provides 3.3 db (ada4304-3) or 2.9 db (ada4304-4) of gain relative to the rf signal present at the input of the device. the input and each output must be properly matched to a 75 environment for distortion and noise performance to match the data sheet specifications. ac coupling capacitors of 0.01 f are recommended for the input and outputs. a 1 h rf choke (coilcraft chip inductor 0805ls-102x) is required to correctly bias the internal nodes of the ada4304-3/ ada4304-4. it should be connected between the 5 v supply and the il pin (pin 14). the choke should be placed as close as possible to the ada4304-3/ada4304-4 to minimize parasitic capacitance on the il pin, which is critical for achieving the specified bandwidth and flatness. evaluation boards the ada4304-3/ada4304-4 evaluati on board allows designers to assess the performance of the parts in their particular application. the board includes 75 coaxial connectors and 75 controlled-impedance signal traces that carry the input and output signals. power (5 v) is applied to the red vcc loop connector, and ground is connected to the black gnd loop connector. figure 21 is a schematic of the evaluation board. on the ada4304-3 evaluation board, connector vo4 and c7 are not populated. rf layout considerations appropriate impedance matching techniques are mandatory when designing circuit boards for the ada4304-3/ada4304-4. improper characteristic impedances on traces can cause reflections that can lead to poor linearity. the characteristic impedance of the signal trace to the input and from each output should be 75 . any ground metal on the top surface near signal lines should be stitched with vias to the internal ground plane, as shown in figure 22 . the device package exposed paddle must be reflow soldered to a low inductance ground to achieve data sheet performance specifications. this is achieved by connecting the footprint ground pad with vias to a ground plane below (see figure 22 ). power supply the 5 v supply should be applied to each vcc pin and rf choke via a low impedance power bus. the power bus should be decoupled to ground using a 10 f tantalum capacitor and a 0.1 f ceramic chip capacitor located close to the ada4304-3/ ada4304-4. in addition, the vcc pins should be decoupled to ground with a 0.1 f ceramic chip capacitor located as close to each pin as possible. ada4304-3/ ada4304-4 l1 1.0 h gnd v cc vin c2 0.01 f vo3 c4 0.01 f vo4 c7 0.01 f vo1 c6 0.01 f vo2 c3 0.01 f c5 10f + c1 0.1f c8 0.1f vcc exposed pad vcc gnd vin gnd vout2 vout3 gnd g n d g n d g n d v o u t 4 a d a 4 3 0 4 - 4 o n l y v c c v c c i l v o u t 1 07082-006 figure 21. evaluation board schematic
ada4304-3/ada4304-4 rev. 0 | page 11 of 12 07082-007 figure 22. evaluation board 0 7082-008 figure 23. evaluation board component layout
ada4304-3/ada4304-4 rev. 0 | page 12 of 12 outline dimensions 1 0.50 bsc 0.60 max pin 1 indicator 1.50 ref 0.50 0.40 0.30 0.25 min 0.45 2.75 bsc sq top view 12 max 0.80 max 0.65 typ seating plane pin 1 indicato r 1.00 0.85 0.80 0.30 0.23 0.18 0.05 max 0.02 nom 0.20 ref 3.00 bsc sq * 1.45 1.30 sq 1.15 exposed pad 16 5 13 8 9 12 4 (bottom view) * compliant to jedec standards mo-220-veed-2 except for exposed pad dimension. figure 24. 16-lead lead frame chip scale package [lfcsp_vq] 3 mm 3 mm body, very thin quad (cp-16-2) dimensions shown in millimeters ordering guide model temperature range package description pa ckage option ordering quantity branding ada4304-3acpz-rl 1 ?40c to +85c 16-lead lfcsp_vq cp-16-2 5,000 h16 ada4304-3acpz-r7 1 ?40c to +85c 16-lead lfcsp_vq cp-16-2 1,500 h16 ada4304-3acpz-r2 1 ?40c to +85c 16-lead lfcsp_vq cp-16-2 250 h16 ada4304-4acpz-rl 1 ?40c to +85c 16-lead lfcsp_vq cp-16-2 5,000 h10 ada4304-4acpz-r7 1 ?40c to +85c 16-lead lfcsp_vq cp-16-2 1,500 h10 ADA4304-4ACPZ-R2 1 ?40c to +85c 16-lead lfcsp_vq cp-16-2 250 h10 1 z = rohs compliant part. ?2007 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d07082-0-11/07(0)

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